Mike
Ace Dawg! RQQ!!!!
One of my friends sent me this. He's to "LAME" to post on the board, but here it is.
FYI...
Subject: Leadership Engineering Positions @ IBM
If you know of any engineers looking for job opportunities, please pass
along. Terry Davis at IBM said it took 1.5 years to make this happen. These
jobs are not published on the website. Their target is African-American
professionals. Please use this to your advantage to find an opportunity to
gain the skills necessary to compete in Corporate America.
They are paying for RELOCATION! Please network and help those who are
seeking employment. If you know of anyone who has a top-secret clearance,
IBM has many opportunities in the Virginia, Maryland and DC area.
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
We are aggressively looking for some Profession al Engineers for Positions @
IBM in San Jose, Boston, Fishkill, Austin, Raleigh, North Carolina,
Rochester, and Burlington, that will have the high-level career advancement
and visibility, to potentially enable the selected candidates to become IBM
Executives in 2-3 years. We will provide Relocation, if necessary. These
candidates will be PHD Engineering types with 5-10 years of experience and
Corporate Executive potential. Below are the eleven listed positions. Please
forward your resume to the designated IBM personnel assigned to each job
position and/or forward this note to colleagues who may be interested in
these exciting opportunities @ IBM. Thanks in advance for your interest in
IBM.
1) File/Baseplate Layout Designer - San Jose:
Skills in Mechanical design, experienced using design tools such as CAD,
ability to work with vendors and have manufacturing tooling design
knowledge. The successful candidate will have strong experience in computer
aided design (CAD) tools, with application to design systems with several
parts. Must have leadership or experience in working with a team to resolve
conflicting requirements in higher level assembly. Experience with
tolerance analysis, including use of 3D computer-based tools. Use of FEM or
other analysis tools to solve statics or dynamics problems is also helpful.
Experience with improving acoustics of consumer products is also a plus.
Successful candidates could come from any industry with compact packaging of
electromechanical components (e.g. printers, copies, food processors,
computers). Send Resumes to TerryDav@US.IBM.COM.
2) Flex Development Engineer - San Jose:
Dynamics/Electrical Engineering or Process Development Engineer skills and
knowledge. Send Resumes to TerryDav@US.IBM.COM.
3) ASIC Application Engineering - Austin, Raleigh, Burlington or Rochester:
oad knowledge skills in ASIC design tools and methods, hands on detailed
technical skills and 10 years of ASIC design and management experience.
Will lead an ASIC application engineering team responsible for technical
support and management of high profile, high revenue ASIC programs. Work
with customers in a teaming relationship, driving programs to completion by
applying hands-on design experience and management skills. Support will be
provided from pre-sales through prototyping-up requiring expertise in all
aspects of ASIC design, including architecture, synthesis, static timing,
physical design, test and debug/failure analysis. Strong communication and
interpersonal skills are required to drive resolution of complex technical
issues. Will take the lead on key technical initiatives within ASICs
including design time reduction and design for yield. Apply experience to
drive tool and methodology changes that will achieve more rapid design times
and have higher manufacturing yield. Take leadership role in inging new and
expanding capabilities to all of the ASIC design centers worldwide. Send
Resumes to TerryDav@US.IBM.COM.
4) Semi Conductor Process Engineer - Fishkill:
Field of Study and experience will be in Chemistry or Chemical Engineering
background. Must have Semiconductor processing, Strong Project Management
background and 8+ year's experience in semiconductor environment. Candidate
will responsible for the ing-up, debug and qualification of semiconductor
tooling in BEOL operations. Job scope will include wet etches/cleans,
electrolytic and electroless plating and chem-mech polish operations.
Subsequent responsibilities will include ensuring
manufacturing line stability, as well as the implementation of cost
reductions, and the installation of future technologies. Will need to
coordinate activities with both development and production personnel. Send
Resumes to TerryDav@US.IBM.COM.
5) Fab Litho Process Engineer - San Jose:
Lead team in developing improved lithography techniques for air bearings.
Must have lithography, ion milling and RIE experience in order to optimize
the processes to achieve tighter tolerance for fly height control. Must
understand the principle of photolithography, including image formation.
Must have hands on experience in process development with A)
Evaluation/Selection of photoresist; B) Process development and
optimization; C) Resolving lithography process issues such as
imension/overlay control. Must be familiar with Ultratech stepper and G, H
line resist system and have a familiar working knowledge in evaluation,
source inspection and acceptance of the new stepper/track would be a plus.
Field of study will be Physics, Material Science or Chemical Engineering.
Send Resumes to SteveWil@US.IBM.COM.
6) Substrate Engineer - Field of study will be in Engineering, Physics, or
Material Science - San Jose:
Candidate will lead the development effort on glass and aluminum substrates.
Requirements for low fly height, and disk orientation need to be fulfilled
together. New materials, new processes, and new metrology methods must be
understood and incorporated into our designs. Special emphasis will be
placed on textured substrates. The ideal candidate will have experience in
substrate design including texture, and mechanical and magnetic integration.
Experience requirement: 5 years total, 2 in media specifically. Send Resumes
to SteveWil@US.IBM.COM.
7) Verification Tool Design Software Engineer - Fishkill:
3-5 years of skills in Diva Deck Development, Assura Deck Development,
Hercules Deck Development and Cali e Deck Development. Development of
Diva/Assura/Hercules/ Cali e verification decks and the implementation of
LVS, DRC, and parasitic extraction in the Cadence environment. Candidate
must also interface with the ASIC design kit team and provide customer
support in the verification of EDA tools. Strong knowledge of skill code,
cadence platform and familiarity with Avanti and Menthor tools is required.
Minimum experience is 3-5 years with successful implementation of
verification deck in an industry environment. Send Resumes to
SteveWil@US.IBM.COM.
8) Firmware Code Skills Engineer - San Jose: Must have experienced Hard Disk
Drive background with Firmware Code Skills Engineer, C++ preferred,
Extensive Hard Disk Drive electronics and system knowledge. Send Resumes to
Nicolemg@US.IBM.COM.
9) Field Application/Field Quality Engineer - Boston, Massachusetts: Must
have excellent knowledge and experience in Hard Drive Technical and Customer
Interface. Must know Mechanical, Electrical, and magnetic design point
knowledge. Must have working knowledge of Hard Disk Drives analysis tools as
analyzers, oscilloscopes, testers and software utilities. Previous
development or manufacturing experience is preferred. Field of study would
be Electrical Engineering. Send Resumes to Nicolemg@US.IBM.COM.
10) Lead Logic Design Engineer - Austin: Skills in Microprocessor
Architecture, Memory Subsystem Design, VHDL Logic Design, Static timing with
ASX, ASTAP, HSPICE and CMOS Circuit Design. Lead the logic design of a
sub-unit of the MFC (Memory Flow Controller) unit of a leading edge
processor currently under development. Candidate would interact with the
Technical Lead and Chief Architect to guide the implementation to insure
that it meets the architecture with priority on low power and die size. The
candidate must have significant experience (7-10 years) in microprocessor
related logic design projects within the industry. Must have fluency and
productivity with industry standard design automation tools is required.
Working with multicompany design team makes teamwork, communication and
interpersonal skills critical in condition to technical skills. The
candidate will serve as a leader and mentor for less experienced members of
the team, therefore,leadership and employee development abilities are
expected. Send Resumes to Nicolemg@US.IBM.COM.
11) Device Modeling Engineer - Fishkill: Strong background and skills in
Device physics, Data analysis and Parameter extraction, Compact model
formulation and SPICE-like simulation. Development of compact device models
which are used in the CAD design kits by circuit designers for IBM's RF CMOS
and SiGe BiCMOS technologies. Industry standard models for bipolar (e.g.,
VIC, HiCUM) and MOSFET (e.g., BSIM3, BSIM 4) devices are used as well as the
definition of subcircuits to represent resistor, capacitor, diode and
inductor passives. The job depends on extensive software use for data
analysis, parameter extraction and simulation of all device level
characteristics. Send Resumes to Nicolemg@US.IBM.COM.
Good Luck peeps!
FYI...
Subject: Leadership Engineering Positions @ IBM
If you know of any engineers looking for job opportunities, please pass
along. Terry Davis at IBM said it took 1.5 years to make this happen. These
jobs are not published on the website. Their target is African-American
professionals. Please use this to your advantage to find an opportunity to
gain the skills necessary to compete in Corporate America.
They are paying for RELOCATION! Please network and help those who are
seeking employment. If you know of anyone who has a top-secret clearance,
IBM has many opportunities in the Virginia, Maryland and DC area.
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
We are aggressively looking for some Profession al Engineers for Positions @
IBM in San Jose, Boston, Fishkill, Austin, Raleigh, North Carolina,
Rochester, and Burlington, that will have the high-level career advancement
and visibility, to potentially enable the selected candidates to become IBM
Executives in 2-3 years. We will provide Relocation, if necessary. These
candidates will be PHD Engineering types with 5-10 years of experience and
Corporate Executive potential. Below are the eleven listed positions. Please
forward your resume to the designated IBM personnel assigned to each job
position and/or forward this note to colleagues who may be interested in
these exciting opportunities @ IBM. Thanks in advance for your interest in
IBM.
1) File/Baseplate Layout Designer - San Jose:
Skills in Mechanical design, experienced using design tools such as CAD,
ability to work with vendors and have manufacturing tooling design
knowledge. The successful candidate will have strong experience in computer
aided design (CAD) tools, with application to design systems with several
parts. Must have leadership or experience in working with a team to resolve
conflicting requirements in higher level assembly. Experience with
tolerance analysis, including use of 3D computer-based tools. Use of FEM or
other analysis tools to solve statics or dynamics problems is also helpful.
Experience with improving acoustics of consumer products is also a plus.
Successful candidates could come from any industry with compact packaging of
electromechanical components (e.g. printers, copies, food processors,
computers). Send Resumes to TerryDav@US.IBM.COM.
2) Flex Development Engineer - San Jose:
Dynamics/Electrical Engineering or Process Development Engineer skills and
knowledge. Send Resumes to TerryDav@US.IBM.COM.
3) ASIC Application Engineering - Austin, Raleigh, Burlington or Rochester:
oad knowledge skills in ASIC design tools and methods, hands on detailed
technical skills and 10 years of ASIC design and management experience.
Will lead an ASIC application engineering team responsible for technical
support and management of high profile, high revenue ASIC programs. Work
with customers in a teaming relationship, driving programs to completion by
applying hands-on design experience and management skills. Support will be
provided from pre-sales through prototyping-up requiring expertise in all
aspects of ASIC design, including architecture, synthesis, static timing,
physical design, test and debug/failure analysis. Strong communication and
interpersonal skills are required to drive resolution of complex technical
issues. Will take the lead on key technical initiatives within ASICs
including design time reduction and design for yield. Apply experience to
drive tool and methodology changes that will achieve more rapid design times
and have higher manufacturing yield. Take leadership role in inging new and
expanding capabilities to all of the ASIC design centers worldwide. Send
Resumes to TerryDav@US.IBM.COM.
4) Semi Conductor Process Engineer - Fishkill:
Field of Study and experience will be in Chemistry or Chemical Engineering
background. Must have Semiconductor processing, Strong Project Management
background and 8+ year's experience in semiconductor environment. Candidate
will responsible for the ing-up, debug and qualification of semiconductor
tooling in BEOL operations. Job scope will include wet etches/cleans,
electrolytic and electroless plating and chem-mech polish operations.
Subsequent responsibilities will include ensuring
manufacturing line stability, as well as the implementation of cost
reductions, and the installation of future technologies. Will need to
coordinate activities with both development and production personnel. Send
Resumes to TerryDav@US.IBM.COM.
5) Fab Litho Process Engineer - San Jose:
Lead team in developing improved lithography techniques for air bearings.
Must have lithography, ion milling and RIE experience in order to optimize
the processes to achieve tighter tolerance for fly height control. Must
understand the principle of photolithography, including image formation.
Must have hands on experience in process development with A)
Evaluation/Selection of photoresist; B) Process development and
optimization; C) Resolving lithography process issues such as
imension/overlay control. Must be familiar with Ultratech stepper and G, H
line resist system and have a familiar working knowledge in evaluation,
source inspection and acceptance of the new stepper/track would be a plus.
Field of study will be Physics, Material Science or Chemical Engineering.
Send Resumes to SteveWil@US.IBM.COM.
6) Substrate Engineer - Field of study will be in Engineering, Physics, or
Material Science - San Jose:
Candidate will lead the development effort on glass and aluminum substrates.
Requirements for low fly height, and disk orientation need to be fulfilled
together. New materials, new processes, and new metrology methods must be
understood and incorporated into our designs. Special emphasis will be
placed on textured substrates. The ideal candidate will have experience in
substrate design including texture, and mechanical and magnetic integration.
Experience requirement: 5 years total, 2 in media specifically. Send Resumes
to SteveWil@US.IBM.COM.
7) Verification Tool Design Software Engineer - Fishkill:
3-5 years of skills in Diva Deck Development, Assura Deck Development,
Hercules Deck Development and Cali e Deck Development. Development of
Diva/Assura/Hercules/ Cali e verification decks and the implementation of
LVS, DRC, and parasitic extraction in the Cadence environment. Candidate
must also interface with the ASIC design kit team and provide customer
support in the verification of EDA tools. Strong knowledge of skill code,
cadence platform and familiarity with Avanti and Menthor tools is required.
Minimum experience is 3-5 years with successful implementation of
verification deck in an industry environment. Send Resumes to
SteveWil@US.IBM.COM.
8) Firmware Code Skills Engineer - San Jose: Must have experienced Hard Disk
Drive background with Firmware Code Skills Engineer, C++ preferred,
Extensive Hard Disk Drive electronics and system knowledge. Send Resumes to
Nicolemg@US.IBM.COM.
9) Field Application/Field Quality Engineer - Boston, Massachusetts: Must
have excellent knowledge and experience in Hard Drive Technical and Customer
Interface. Must know Mechanical, Electrical, and magnetic design point
knowledge. Must have working knowledge of Hard Disk Drives analysis tools as
analyzers, oscilloscopes, testers and software utilities. Previous
development or manufacturing experience is preferred. Field of study would
be Electrical Engineering. Send Resumes to Nicolemg@US.IBM.COM.
10) Lead Logic Design Engineer - Austin: Skills in Microprocessor
Architecture, Memory Subsystem Design, VHDL Logic Design, Static timing with
ASX, ASTAP, HSPICE and CMOS Circuit Design. Lead the logic design of a
sub-unit of the MFC (Memory Flow Controller) unit of a leading edge
processor currently under development. Candidate would interact with the
Technical Lead and Chief Architect to guide the implementation to insure
that it meets the architecture with priority on low power and die size. The
candidate must have significant experience (7-10 years) in microprocessor
related logic design projects within the industry. Must have fluency and
productivity with industry standard design automation tools is required.
Working with multicompany design team makes teamwork, communication and
interpersonal skills critical in condition to technical skills. The
candidate will serve as a leader and mentor for less experienced members of
the team, therefore,leadership and employee development abilities are
expected. Send Resumes to Nicolemg@US.IBM.COM.
11) Device Modeling Engineer - Fishkill: Strong background and skills in
Device physics, Data analysis and Parameter extraction, Compact model
formulation and SPICE-like simulation. Development of compact device models
which are used in the CAD design kits by circuit designers for IBM's RF CMOS
and SiGe BiCMOS technologies. Industry standard models for bipolar (e.g.,
VIC, HiCUM) and MOSFET (e.g., BSIM3, BSIM 4) devices are used as well as the
definition of subcircuits to represent resistor, capacitor, diode and
inductor passives. The job depends on extensive software use for data
analysis, parameter extraction and simulation of all device level
characteristics. Send Resumes to Nicolemg@US.IBM.COM.
Good Luck peeps!
